Yayınlar & Eserler

Makaleler 11
Tümü (11)
SCI-E, SSCI, AHCI (11)
SCI-E, SSCI, AHCI, ESCI (11)
ESCI (1)
Scopus (11)
Hakemli Bilimsel Toplantılarda Yayımlanmış Bildiriler 25

1. Shadow Void Optimization of Microelectronic Packages with Tree-Based Learners

29th IEEE Workshop on Signal and Power Integrity, SPI 2025, Gaeta, İtalya, 11 - 14 Mayıs 2025, (Tam Metin Bildiri)

2. Fine-Pitch Interconnect Modeling Using Physics-Informed Neural Networks

29th IEEE Workshop on Signal and Power Integrity, SPI 2025, Gaeta, İtalya, 11 - 14 Mayıs 2025, (Tam Metin Bildiri)

3. Tree-Based Boosting for Efficient Estimation of S-Parameters for Package Electrical Analysis

33rd Conference on Electrical Performance of Electronic Packaging and Systems, Toronto, Kanada, 6 - 09 Ekim 2024, (Tam Metin Bildiri) Sürdürülebilir Kalkınma

4. Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks

33rd Conference on Electrical Performance of Electronic Packaging and Systems, Toronto, Kanada, 6 - 09 Ekim 2024, (Tam Metin Bildiri)

5. Tree-based Sequential Sampling for Efficient Designs in Package Electrical Analysis

28th Workshop on Signal and Power Integrity (SPI), Lisbon, Portekiz, 12 - 15 Mayıs 2024, (Tam Metin Bildiri)

6. A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling

EEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), California, Amerika Birleşik Devletleri, 15 - 18 Ekim 2023, ss.1-3, (Tam Metin Bildiri)

7. A Flexible Neural Network-Based Tool for Package Second Level Interconnect Modeling

IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), California, Amerika Birleşik Devletleri, 15 - 18 Ekim 2023, (Tam Metin Bildiri)

8. Neural Network Modeling of Antennas on Package for 5G Applications

17th European Conference on Antennas and Propagation, EuCAP 2023, Florence, İtalya, 26 - 31 Mart 2023, (Tam Metin Bildiri)

9. Dual sided high frequency measurement of microelectronic packages

29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, California, Amerika Birleşik Devletleri, 5 - 07 Ekim 2020, (Tam Metin Bildiri)

10. Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters

28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Montreal, Kanada, 6 - 09 Ekim 2019, (Tam Metin Bildiri)

11. Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration

69th IEEE Electronic Components and Technology Conference (ECTC), Nevada, Amerika Birleşik Devletleri, 29 - 31 Mayıs 2019, ss.667-673, (Tam Metin Bildiri)

12. Design of Low-loss Transmission Lines with Common Mode Suppression for Packages

27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), San-Jose, Kostarika, 14 - 17 Ekim 2018, ss.43-45, (Tam Metin Bildiri)

13. Fiber Weave Impact on Crosstalk of High Speed Communication Channels in Glass Epoxy Packages

IEEE International Symposium on Electromagnetic Compatibility (EMC), Ottawa, Kanada, 25 - 29 Temmuz 2016, (Tam Metin Bildiri)

14. Reflection Phase and Surface Wave Propagation Characteristics of a Symmetrical Perforated High Impedance Surface

IEEE-Antennas-and-Propagation-Society International Symposium, Fajardo, Porto Riko, 26 Haziran - 01 Temmuz 2016, ss.1963-1964, (Tam Metin Bildiri)

15. Impact of Fiber Weaves on 56 Gbps SerDes Interface in Glass Epoxy Packages

24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San-Jose, Kostarika, 25 - 28 Ekim 2015, ss.159-161, (Tam Metin Bildiri)

16. Reflection Phase Characterization of a Circularly Symmetric High Impedance Surface

IEEE Antennas-and-Propagation-Society International Symposium (APSURSI), Tennessee, Amerika Birleşik Devletleri, 6 - 11 Temmuz 2014, ss.1772-1773, (Tam Metin Bildiri)

17. Surface Wave Suppression Properties of Perforated Artificial Impedance Surfaces

International Symposium of the IEEE-Antennas-and-Propagation-Society, Florida, Amerika Birleşik Devletleri, 7 - 13 Temmuz 2013, ss.89-90, (Tam Metin Bildiri)

18. Surface Wave Effects on the Reflection Phase of Curved High Impedance Surfaces

International Symposium of the IEEE-Antennas-and-Propagation-Society, Florida, Amerika Birleşik Devletleri, 7 - 13 Temmuz 2013, ss.87-88, (Tam Metin Bildiri)

19. A Novel HIS with a Perforated Ground Plane for Miniaturization and Bandwidth Enhancement

IEEE International Symposium on Antennas and Propagation, Illinois, Amerika Birleşik Devletleri, 8 - 14 Temmuz 2012, (Tam Metin Bildiri)

20. Plane Wave Scattering from a Curved HIS: Normal Incidence

IEEE International Symposium on Antennas and Propagation, Illinois, Amerika Birleşik Devletleri, 8 - 14 Temmuz 2012, (Tam Metin Bildiri)

21. Flexible Bow-Tie Antennas with Reduced Metallization

IEEE Radio and Wireless Symposium (RWS), Arkansas, Amerika Birleşik Devletleri, 16 - 19 Ocak 2011, ss.50-53, (Tam Metin Bildiri)

22. Radiation Characteristics of a Flexible Bow-tie Antenna

IEEE International Symposium on Antennas and Propagation (APSURSI)/USNC/URSI National Radio Science Meeting, Washington, Amerika Birleşik Devletleri, 3 - 08 Temmuz 2011, ss.1239-1242, (Tam Metin Bildiri)

23. Physical Realization and Reflection Phase Characteristics of a Flexible High Impedance Surface

IEEE International Symposium on Antennas and Propagation (APSURSI)/USNC/URSI National Radio Science Meeting, Washington, Amerika Birleşik Devletleri, 3 - 08 Temmuz 2011, ss.1844-1847, (Tam Metin Bildiri)

24. Flexible Bow-tie Antennas

2010 IEEE International Symposium Antennas and Propagation/CNC-USNC/URSI Radio Science Meeting, Toronto, Kanada, 11 - 17 Temmuz 2010, (Tam Metin Bildiri)

25. Computation of Physical Optics Integral by Levin's Algorithm on NURBS

2010 IEEE International Symposium Antennas and Propagation/CNC-USNC/URSI Radio Science Meeting, Toronto, Kanada, 11 - 17 Temmuz 2010, (Tam Metin Bildiri)
Metrikler

Yayın

36

Yayın (WoS)

33

Yayın (Scopus)

35

Atıf (WoS)

381

H-İndeks (WoS)

7

Atıf (Scopus)

576

H-İndeks (Scopus)

9

Atıf (Scholar)

666

H-İndeks (Scholar)

10

Atıf (Diğer Toplam)

1

Proje

2

Tez Danışmanlığı

5

Açık Erişim

5
BM Sürdürülebilir Kalkınma Amaçları