Akademik Veri Yönetim Sistemi
29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, California, Amerika Birleşik Devletleri, 5 - 07 Ekim 2020
© 2020 IEEE.Traditionally, validation of simulation data of microelectronic packages has been done by high frequency measurement of coplanar transmission line structures. Although this metrology has matured over the years, it is not directly applicable to product packages since they also include vertical interconnects. To address this issue, we developed a dual-sided measurement metrology, by utilizing a special fixture design and employing short-open-load-reciprocal calibration to maintain measurement stability at high frequencies. Metrology capability analysis shows that there is minimal operator and environmental condition dependency and a very good correlation with simulations up to 40 GHz for differential transmission lines.