Dual sided high frequency measurement of microelectronic packages

Christ S. R., Durgun A. C., Aygun K., Hill M. J.

29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, California, United States Of America, 5 - 07 October 2020 identifier

  • Publication Type: Conference Paper / Full Text
  • Volume:
  • Doi Number: 10.1109/epeps48591.2020.9231489
  • City: California
  • Country: United States Of America
  • Middle East Technical University Affiliated: No


© 2020 IEEE.Traditionally, validation of simulation data of microelectronic packages has been done by high frequency measurement of coplanar transmission line structures. Although this metrology has matured over the years, it is not directly applicable to product packages since they also include vertical interconnects. To address this issue, we developed a dual-sided measurement metrology, by utilizing a special fixture design and employing short-open-load-reciprocal calibration to maintain measurement stability at high frequencies. Metrology capability analysis shows that there is minimal operator and environmental condition dependency and a very good correlation with simulations up to 40 GHz for differential transmission lines.