Christ, S. R. Et Al. 2020. Dual sided high frequency measurement of microelectronic packages. 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020 , (California, United States Of America).

Christ, S. R., Durgun, A. C., Aygun, K., & Hill, M. J., (2020). Dual sided high frequency measurement of microelectronic packages . 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, California, United States Of America

Christ, Sean Et Al. "Dual sided high frequency measurement of microelectronic packages," 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020, California, United States Of America, 2020

Christ, Sean R. Et Al. "Dual sided high frequency measurement of microelectronic packages." 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020 , California, United States Of America, 2020

Christ, S. R. Et Al. (2020) . "Dual sided high frequency measurement of microelectronic packages." 29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020 , California, United States Of America.

@conferencepaper{conferencepaper, author={Sean R. Christ Et Al. }, title={Dual sided high frequency measurement of microelectronic packages}, congress name={29th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2020}, city={California}, country={United States Of America}, year={2020}}