Publications & Works

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Papers Presented at Peer-Reviewed Scientific Conferences 3

1. Wafer Level Au Sn TLP Bonding from Eutectic Composition

YILMAZ S., DEMİR E. C., Temel O., AKIN T., KALAY Y. E.
TMS 2016, United States Of America, 14 - 18 February 2016, (Summary Text)

2. Development of Wafer Level Au Sn Eutectic Bonding Techniques for MEMS Applications

YILMAZ S., Demir E. C., Temel O., AKIN T., KALAY Y. E.
Elektron Mikroskobi Kongresi, Turkey, 2 - 04 September 2015

3. Optimum Design of 6R Passive Haptic Robotic Arm for Implant Surgery

Yilmaz S., KONUKSEVEN E. İ., Gurocak H.
EuroHaptics International Conference on Generating and Perceiving Tangible Sensations, Amsterdam, Netherlands, 8 - 10 July 2010, vol.6191, pp.105-106, (Full Text) identifier
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