Tez Dosyaları 17
BONDING MATERIAL DEVELOPMENT AT WAFER LEVEL VACUUM
PACKAGING FOR MEMS DEVICES BY TRANSIENT LIQUID PHASE (TLP)
METHOD
GÖRÜNTÜLEME UYGULAMALARI İÇİN DÜŞÜK GÜÇ TÜKETİMLİ, YÜKSEK PERFORMANSLI ANALOG-SAYISAL ÇEVİRİCİ TÜMLEŞİK DEVRESİ
Camera electronics for low-cost microbolometer type infrared detectors
Design and implementation of perforation on high fill factor structures for uncooled infrared sensors
Low-power low-noise highly programmable digital accelerometer readout for high performance MEMS accelerometers
Development of small size uncooled infrared microbolometer pixel
DİJİTAL KONTROL DÖNGÜLERİ KULLANARAK MEMS TİTREŞEN YAY TİPİ İVMEÖLÇER İÇİN YÜKSEK PERFORMANSLI OKUMA DEVRESİ GELİŞTİRİLMESİ
LİDAR UYGULAMALARI İÇİN 125PS LSB KOLON PARALEL ZAMAN-SAYISAL ÇEVİRİCİ TÜMLEŞİK DEVRESİ
Novel metal assisted etching technique for enhanced light management in black crystalline si solar cells
A THREE AXIS CAPACITIVE MEMS ACCELEROMETER ON A MULTI-STACK SUBSTRATE
Development of ligand exchange and coating strategies for the colloidal quantum dot based high-resolution short-wave infrared imaging sensors
Düşük sabit kayma hatası kaymasına sahip silisyum tabanlı rezonant ivmeölçer
An ASIC chip design with advanced image correction architectures for CMOS infrared imagers
An uncooled infrared microbolometer detector array using surface micromachined mems technology
Soğutmasız görüntüleme sistemleri için kolon paralel artımlı zoom analog-sayısal çevirici
A readout circuit for resonant mems temperature sensors
DİJİTAL OLARAK KONTROL EDİLEN MEMS DÖNÜÖLÇER SİSTEMİ