A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION


Beker L., Zorlu O., KÜLAH H.

26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Taipei, Taiwan, 20 - 24 January 2013, pp.267-270 identifier

  • Publication Type: Conference Paper / Full Text
  • City: Taipei
  • Country: Taiwan
  • Page Numbers: pp.267-270

Abstract

This paper presents a wafer level attachment method for handling various shaped structures for MEMS processes, using parylene as an interlayer material. In this method, a handle wafer containing pillars and perforations is utilized, and structures are attached to the handle wafer through a parylene coating process realized at room temperature with no applied force. It is observed that pillars with 20 mu m height, 2.5 mm side length, and 4.5 mm spacing can successfully be used to attach two 4 '' substrates to each other. The shear strength between the attached substrates is measured as 0.49 MPa, proving the feasibility of the method for integrating various materials into MEMS processes.