Beker, L. Et Al. 2013. A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION. 26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) , (Taipei, Taiwan), 267-270.

Beker, L., Zorlu, O., & KÜLAH, H., (2013). A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION . 26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (pp.267-270). Taipei, Taiwan

Beker, Levent, Ozge Zorlu, And HALUK KÜLAH. "A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION," 26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Taipei, Taiwan, 2013

Beker, Levent Et Al. "A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION." 26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) , Taipei, Taiwan, pp.267-270, 2013

Beker, L. Zorlu, O. And KÜLAH, H. (2013) . "A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION." 26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) , Taipei, Taiwan, pp.267-270.

@conferencepaper{conferencepaper, author={Levent Beker Et Al. }, title={A ROOM TEMPERATURE, ZERO FORCE, WAFER-LEVEL ATTACHMENT METHOD FOR MEMS INTEGRATION}, congress name={26th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)}, city={Taipei}, country={Taiwan}, year={2013}, pages={267-270} }