Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs


Mert Torunbalci M., Alper S. E. , Akın T.

1st IEEE International Symposium on Inertial Sensors and Systems, ISISS 2014, Laguna Beach, CA, United States Of America, 25 - 26 February 2014 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/isiss.2014.6782539
  • City: Laguna Beach, CA
  • Country: United States Of America
  • Keywords: Wafer level hermetic packaging, vertical feedthroughs, Au-Si eutectic bonding, MEMS inertial sensors