Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs


Mert Torunbalci M., Alper S. E., Akın T.

1st IEEE International Symposium on Inertial Sensors and Systems, ISISS 2014, Laguna Beach, CA, United States Of America, 25 - 26 February 2014 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/isiss.2014.6782539
  • City: Laguna Beach, CA
  • Country: United States Of America
  • Keywords: Wafer level hermetic packaging, vertical feedthroughs, Au-Si eutectic bonding, MEMS inertial sensors
  • Middle East Technical University Affiliated: Yes