Stepped-etching for preserving critical dimensions in through-wafer deep reactive ion etching of thick silicon

Alper S. E., Aydemir A., AKIN T.

TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, United States Of America, 21 - 25 June 2009, pp.1110-1113 identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/sensor.2009.5285924
  • City: Denver, CO
  • Country: United States Of America
  • Page Numbers: pp.1110-1113
  • Middle East Technical University Affiliated: Yes