Resonance-Based Temperature Sensors using a Wafer Level Vacuum Packaged SOI MEMS Process

Aydın G. D. , Akın T.

Advanced Materials Letters, vol.11, no.1, 2020 (Journal Indexed in ESCI)

  • Publication Type: Article / Article
  • Volume: 11 Issue: 1
  • Publication Date: 2020
  • Doi Number: 10.5185/amlett.2020.011462
  • Title of Journal : Advanced Materials Letters