Resonance-Based Temperature Sensors using a Wafer Level Vacuum Packaged SOI MEMS Process

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Aydın G. D., Akın T.

Advanced Materials Letters, vol.11, no.1, 2020 (Peer-Reviewed Journal)

• Publication Type: Article / Article
• Volume: 11 Issue: 1
• Publication Date: 2020
• Doi Number: 10.5185/amlett.2020.011462
• Journal Name: Advanced Materials Letters
• Journal Indexes: Other Indexes
• Middle East Technical University Affiliated: Yes