A method and electrical model for the anodic bonding of SOI and glass wafers

Tatar E., Torunbalci M., Alper S., AKIN T.

2012 IEEE 25th International Conference on Micro Electro Mechanical Systems, MEMS 2012, Paris, France, 29 January - 02 February 2012, pp.68-71 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/memsys.2012.6170095
  • City: Paris
  • Country: France
  • Page Numbers: pp.68-71
  • Middle East Technical University Affiliated: Yes