Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process

Torunbalci M. M., Alper S. E., Akın T.

2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS), Hawaii, United States Of America, 23 - 26 March 2015, pp.86-89 identifier

  • Publication Type: Conference Paper / Full Text
  • City: Hawaii
  • Country: United States Of America
  • Page Numbers: pp.86-89
  • Middle East Technical University Affiliated: Yes


This paper presents the recent reduction of the die size by 44% in the Advanced MEMS (aMEMS) process, now being compatible in size with most of the available through-wafer packaging processes while offering the unique simplicity of the aMEMS process. Size reduction is achieved by reducing the pitch of vertical feedthroughs from 700 mu m down to 350 mu m and the bonding area width from 300 mu m down to 100 mu m, approaching to the process limits and still preserving the hermeticity of the package. Both small and large dies, containing the identical resonance sensors inside for benchmarking, are produced together on the same wafer. The cavity pressures of the both dies are measured to be around 1 mTorr even after thermal cycling tests.