Torunbalci, M. M. Et Al. 2015. Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process. 2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS) , (Hawaii, United States Of America), 86-89.

Torunbalci, M. M., Alper, S. E., & Akın, T., (2015). Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process . 2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS) (pp.86-89). Hawaii, United States Of America

Torunbalci, Mustafa, Said Emre Alper, And TAYFUN AKIN. "Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process," 2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS), Hawaii, United States Of America, 2015

Torunbalci, Mustafa M. Et Al. "Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process." 2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS) , Hawaii, United States Of America, pp.86-89, 2015

Torunbalci, M. M. Alper, S. E. And Akın, T. (2015) . "Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process." 2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS) , Hawaii, United States Of America, pp.86-89.

@conferencepaper{conferencepaper, author={Mustafa Mert Torunbalci Et Al. }, title={Die Size Reduction by Optimizing the Dimensions of the Vertical Feedthrough Pitch and Sealing Area in the Advanced MEMS (aMEMS) Process}, congress name={2nd IEEE International Symposium on Inertial Sensors and Systems (ISISS)}, city={Hawaii}, country={United States Of America}, year={2015}, pages={86-89} }