Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks

Ünal H. S., DURGUN A. C.

33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Toronto, Canada, 6 - 09 October 2024, (Full Text) identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/epeps61853.2024.10754313
  • City: Toronto
  • Country: Canada
  • Keywords: causal RLGC parameters, fine pitch interconnect, neural network
  • Middle East Technical University Affiliated: Yes

Abstract

In this study, we compare physics-aware neural networks for modeling fine-pitch interconnects. Results show a 5-fold reduction in test loss when imposing DC resistance through analytical equations and preserving the causality relation between resistance and inductance.