H. S. Ünal And A. C. DURGUN, "Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks," 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , Toronto, Canada, 2024
Ünal, H. S. And DURGUN, A. C. 2024. Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks. 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , (Toronto, Canada).
Ünal, H. S., & DURGUN, A. C., (2024). Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks . 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Toronto, Canada
Ünal, Hasan, And AHMET CEMAL DURGUN. "Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks," 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024, Toronto, Canada, 2024
Ünal, Hasan S. And DURGUN, AHMET C. . "Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks." 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , Toronto, Canada, 2024
Ünal, H. S. And DURGUN, A. C. (2024) . "Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks." 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024 , Toronto, Canada.
@conferencepaper{conferencepaper, author={Hasan Said Ünal And author={AHMET CEMAL DURGUN}, title={Causal RL Prediction of Fine-Pitch Interconnects Using Neural Networks}, congress name={33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024}, city={Toronto}, country={Canada}, year={2024}}