A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches

Topallı E., Çetintepe Ç., Aydın Çivi H. Ö., Demir Ş., Akın T.

14th Int. Symposium on RF-MEMS and RF-Microsystems, Potsdam, Germany, 1 - 03 July 2013, (Full Text)

  • Publication Type: Conference Paper / Full Text
  • City: Potsdam
  • Country: Germany
  • Middle East Technical University Affiliated: Yes