A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches


Topallı E., Çetintepe Ç., Aydın Çivi H. Ö. , Demir Ş. , Akın T.

14th Int. Symposium on RF-MEMS and RF-Microsystems, Potsdam, Germany, 1 - 03 July 2013

  • Publication Type: Conference Paper / Full Text
  • City: Potsdam
  • Country: Germany