Topallı, E. Et Al. 2013. A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches. 14th Int. Symposium on RF-MEMS and RF-Microsystems , (Potsdam, Germany).

Topallı, E., Çetintepe, Ç., Aydın Çivi, H. Ö., Demir, Ş., & Akın, T., (2013). A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches . 14th Int. Symposium on RF-MEMS and RF-Microsystems, Potsdam, Germany

Topallı, Ebru Et Al. "A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches," 14th Int. Symposium on RF-MEMS and RF-Microsystems, Potsdam, Germany, 2013

Topallı, Ebru Et Al. "A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches." 14th Int. Symposium on RF-MEMS and RF-Microsystems , Potsdam, Germany, 2013

Topallı, E. Et Al. (2013) . "A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches." 14th Int. Symposium on RF-MEMS and RF-Microsystems , Potsdam, Germany.

@conferencepaper{conferencepaper, author={Ebru Topallı Et Al. }, title={A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches}, congress name={14th Int. Symposium on RF-MEMS and RF-Microsystems}, city={Potsdam}, country={Germany}, year={2013}}