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Hoque M. J., GÜNAY A. A., Stillwell A., Gurumukhi Y., Pilawa-Podgurski R., Miljkovic N.
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019, Anaheim, CA, Amerika Birleşik Devletleri, 7 - 09 Ekim 2019