Hoque, M. J. Et Al. 2019. Modular Heat Sinks for Enhanced Thermal Management of Electronics. International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019 , (Anaheim, CA, United States Of America).

Hoque, M. J., GÜNAY, A. A., Stillwell, A., Gurumukhi, Y., Pilawa-Podgurski, R., & Miljkovic, N., (2019). Modular Heat Sinks for Enhanced Thermal Management of Electronics . International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019, Anaheim, CA, United States Of America

Hoque, Muhammad Et Al. "Modular Heat Sinks for Enhanced Thermal Management of Electronics," International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019, Anaheim, CA, United States Of America, 2019

Hoque, Muhammad J. Et Al. "Modular Heat Sinks for Enhanced Thermal Management of Electronics." International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019 , Anaheim, CA, United States Of America, 2019

Hoque, M. J. Et Al. (2019) . "Modular Heat Sinks for Enhanced Thermal Management of Electronics." International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019 , Anaheim, CA, United States Of America.

@conferencepaper{conferencepaper, author={Muhammad Jahidul Hoque Et Al. }, title={Modular Heat Sinks for Enhanced Thermal Management of Electronics}, congress name={International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019}, city={Anaheim, CA}, country={United States Of America}, year={2019}}