THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS


Torunbalci M. M. , Alper S. E. , AKIN T.

18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Alaska, United States Of America, 21 - 25 June 2015, pp.472-475 identifier

  • Publication Type: Conference Paper / Full Text
  • City: Alaska
  • Country: United States Of America
  • Page Numbers: pp.472-475
  • Middle East Technical University Affiliated: Yes

Abstract

This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a glass cap wafer is used for hermetic encapsulation and routing metallization. Glass-to-silicon anodically bonded seals yield a very stable cavity pressure of 150 mTorr after 15 days. The shear strength of the fabricated packages is above 7 MPa. Temperature cycling and ultra-high temperature shock tests results in no degradation in the hermeticity of the packaged chips.