Torunbalci, M. M. Et Al. 2015. THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS. 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) , (Alaska, United States Of America), 472-475.

Torunbalci, M. M., Alper, S. E., & AKIN, T., (2015). THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS . 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) (pp.472-475). Alaska, United States Of America

Torunbalci, M., S. E. Alper, And TAYFUN AKIN. "THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS," 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), Alaska, United States Of America, 2015

Torunbalci, M. M. Et Al. "THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS." 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) , Alaska, United States Of America, pp.472-475, 2015

Torunbalci, M. M. Alper, S. E. And AKIN, T. (2015) . "THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS." 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) , Alaska, United States Of America, pp.472-475.

@conferencepaper{conferencepaper, author={M. M. Torunbalci Et Al. }, title={THE ADVANCED MEMS (aMEMS) PROCESS FOR FABRICATING WAFER LEVEL VACUUM PACKAGED SOI-MEMS DEVICES WITH EMBEDDED VERTICAL FEEDTHROUGHS}, congress name={18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)}, city={Alaska}, country={United States Of America}, year={2015}, pages={472-475} }