A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process


Torunbalci M. M. , Alper S. E. , Akın T.

28th European Conference on Solid-State Transducers (EUROSENSORS), Brescia, İtalya, 7 - 10 Eylül 2014, cilt.87, ss.887-890 identifier identifier

  • Cilt numarası: 87
  • Doi Numarası: 10.1016/j.proeng.2014.11.297
  • Basıldığı Şehir: Brescia
  • Basıldığı Ülke: İtalya
  • Sayfa Sayıları: ss.887-890

Özet

This paper presents a new method for wafer level vacuum packaging of MEMS devices using anodic bonding together with vertical feedthroughs formed on an SOI cap wafer, eliminating the need for any sealing material or any complex via-refill or trench-refill vertical feedthrough steps. The packaging yield is experimentally verified to be above 95%, and the cavity pressure is characterized to be as low as 1 mTorr with the help of a thin-film getter. The shear strength of several packages is measured to be above 15MPa. (C) 2014 The Authors. Published by Elsevier Ltd.