A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process

Torunbalci M. M., Alper S. E., Akın T.

28th European Conference on Solid-State Transducers (EUROSENSORS), Brescia, Italy, 7 - 10 September 2014, vol.87, pp.887-890, (Full Text) identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Volume: 87
  • Doi Number: 10.1016/j.proeng.2014.11.297
  • City: Brescia
  • Country: Italy
  • Page Numbers: pp.887-890
  • Keywords: Wafer level packaging, Vertical feedthroughs, Anodic bonding, GLASS
  • Middle East Technical University Affiliated: Yes

Abstract

This paper presents a new method for wafer level vacuum packaging of MEMS devices using anodic bonding together with vertical feedthroughs formed on an SOI cap wafer, eliminating the need for any sealing material or any complex via-refill or trench-refill vertical feedthrough steps. The packaging yield is experimentally verified to be above 95%, and the cavity pressure is characterized to be as low as 1 mTorr with the help of a thin-film getter. The shear strength of several packages is measured to be above 15MPa. (C) 2014 The Authors. Published by Elsevier Ltd.