Torunbalci, M. M. Et Al. 2014. A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process. 28th European Conference on Solid-State Transducers (EUROSENSORS) , (Brescia, Italy), 887-890.

Torunbalci, M. M., Alper, S. E., & Akın, T., (2014). A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process . 28th European Conference on Solid-State Transducers (EUROSENSORS) (pp.887-890). Brescia, Italy

Torunbalci, Mustafa, Said Emre Alper, And TAYFUN AKIN. "A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process," 28th European Conference on Solid-State Transducers (EUROSENSORS), Brescia, Italy, 2014

Torunbalci, Mustafa M. Et Al. "A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process." 28th European Conference on Solid-State Transducers (EUROSENSORS) , Brescia, Italy, pp.887-890, 2014

Torunbalci, M. M. Alper, S. E. And Akın, T. (2014) . "A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process." 28th European Conference on Solid-State Transducers (EUROSENSORS) , Brescia, Italy, pp.887-890.

@conferencepaper{conferencepaper, author={Mustafa Mert Torunbalci Et Al. }, title={A Method of Fabricating Vacuum Packages with Vertical Feedthroughs in a Wafer Level Anodic Bonding Process}, congress name={28th European Conference on Solid-State Transducers (EUROSENSORS)}, city={Brescia}, country={Italy}, year={2014}, pages={887-890} }