A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches | AVESİS

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A Fabrication Process Flow for Stacked Structural Layer Formation Using Au Au Thermocompression Bonding for RF MEMS Capacitive Switches

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Topallı E., Çetintepe Ç., Aydın Çivi H. Ö., Demir Ş., Akın T.

14th Int. Symposium on RF-MEMS and RF-Microsystems, Potsdam, Germany, 1 - 03 July 2013

Publication Type: Conference Paper / Full Text
City: Potsdam
Country: Germany
Middle East Technical University Affiliated: Yes