Modular Heat Sinks for Enhanced Thermal Management of Electronics

Hoque M. J. , GÜNAY A. A. , Stillwell A., Gurumukhi Y., Pilawa-Podgurski R., Miljkovic N.

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019, Anaheim, CA, United States Of America, 7 - 09 October 2019

  • Publication Type: Conference Paper / Summary Text
  • City: Anaheim, CA
  • Country: United States Of America
  • Middle East Technical University Affiliated: Yes