Tez Dosyaları 10
BONDING MATERIAL DEVELOPMENT AT WAFER LEVEL VACUUM
PACKAGING FOR MEMS DEVICES BY TRANSIENT LIQUID PHASE (TLP)
METHOD
Development of LSF-based dual-phase cathodes for intermediate temperature solid oxide fuel cells
Characterization of Cd1-X ZnX Te single crystals
Al-Ge eutectic bonding for wafer-level vacuum packaging of mems devices
Search for new cathode compositions for mildly acidic Zn-MnO2 batteries
Utilization of (La,Sr)CoO3/(La,Sr)2CoO4 heterostructures as cathode for it-SOFCs
Investigations of solid state phase transformations in manganese-aluminum alloys
A wafer level vacuum packaging technologyfor MEMS based long-wave infrared sensors
Local structures of the Al – Re marginal metallic glasses and liquids: A molecular dynamics study
The effects of chemical short-range order on crystallization pathway in ternary marginal glass forming alloys