SPL-CMM: Software product line capability maturity model

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Tezin Türü: Yüksek Lisans

Tezin Yürütüldüğü Kurum: Orta Doğu Teknik Üniversitesi, Enformatik Enstitüsü, Bilişim Sistemleri Anabilim Dalı, Türkiye

Tezin Onay Tarihi: 2019

Tezin Dili: İngilizce

Öğrenci: RECEP BORA ÇALIŞKANBAŞ

Asıl Danışman (Eş Danışmanlı Tezler İçin): Altan Koçyiğit

Eş Danışman: Ebru Gökalp

Özet:

Software companies show increasing attention to Software Product Line (SPL) approach. SPL provides cost reduction, quality improvements, and reduced delivery time. Because of these benefits, companies want to assess their current level of SPL and to achieve a guidance for improvement. It is a relatively new area of research in which, so far, limited work has been done. These limited studies are based on Business, Architecture, Process and Organization (BAPO) model. In order to check the applicability, usefulness and completeness of the BAPO model, a pilot study and an exploratory case study have been conducted. Based on the feedbacks from these case studies, the Modified BAPO has been achieved. For the validation of the Modified BAPO, an explanatory case study has been conducted. The results indicated that the Modified BAPO is still insufficient, incomplete and not useful. In order to provide a solution that satisfy these requirements, a SPL Capability Maturity Model (SPLCMM) has been developed based on SPICE-ISO/IEC TR 15504. SPL-CMM includes SPL-Process Reference Model (SPL-PRM) consisting of 16 SPL specific process definitions under four process areas of business, architecture, technical and organization as well as a measurement framework providing objective ratings. It is a structured and standardized approach that enables assessment of the SPL specific processes in a consistent, repeatable manner. It is assisted by adequate measures with guidance on actions for improvement. The validation of the proposed model has been performed through conducting a case study. The case study results show that the SPLCMM is applicable for identifying the current state of the SPL process capability and the gaps for process improvement to the next capability level.