Productıon of boron nitride

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Tezin Türü: Doktora

Tezin Yürütüldüğü Kurum: Orta Doğu Teknik Üniversitesi, Mühendislik Fakültesi, Metalurji ve Malzeme Mühendisliği Bölümü, Türkiye

Tezin Onay Tarihi: 1993

Öğrenci: ABDİ AYDOĞDU

Danışman: NACİ SEVİNÇ

Özet:

Boron nitride is found mainly in two crystal structures; in hexagonal structure (h-BN) which is very much like graphite and in cubic structure (c-BN) with properties very close to those of diamond. h-BN is a natural lubricant due to its layered structure. It is generally used in sliding parts of the moving elements such as rotating element beds in turbine shafts. Since c-BN is the hardest known material after diamond it is used in making hard metal covers. In addition to its possible microelectronics applications (can be used to make p-n junction), its resistance to high temperatures and its high forbidden energy gap are its superiorities over diamond. Recent studies have shown that c-BN can be produced by Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) in plasma. But these studies have failed to determine how all of the production parameters (boron and nitrogen sources, composition of the gas used, substrate, RF power, bias voltage, substrate temperature) affect the c-BN content, mechanical stress and the deposition rate of the product with a systematic approach. The systematic study was realized in the range of available experimental ability of the present PVD and CVD equipment and accessories. The BN films were produced in the plasma equipment for CVD using RF and MW and magnetron sputtering and were studied with the measurement and testing facilities. It is believed that with this approach it will be possible to collect enough experimental data to optimize production conditions of BN with desired mechanical and optoelectronic properties. h-BN films were successfully deposited in both systems. It was possible to deposit c-BN films with the MW power, however they were weak in cubic content. Deposition at low pressures eliminated the hydrogen contamination of the films. High substrate temperatures led to more chemically and mechanically stable films.