Akademik Veri Yönetim Sistemi
IEEE JOURNAL OF PHOTOVOLTAICS, 2026 (SCI-Expanded, Scopus)
The reliance of photovoltaic industry on silver (Ag) for silicon solar cell metallization faces critical challenges due to Ag scarcity, cost volatility, and sustainability concerns. Here, we systematically compare advanced metallization strategies that minimize Ag usage while preserving cell performance. We evaluate different approaches such as ultrafine screen printing of Ag, hybrid core-shell metal pastes, pure Ag-free metal pastes (Cu, Ni, Al/Si), and novel deposition techniques of electroplating and multinozzle dispensing. Fine-line printing enables Ag finger widths as narrow as 10-15 mu m, reducing Ag consumption by up to 30% without compromising efficiency. However, fingers widths below 10 mu m introduce printability challenges and increased series resistance. Hybrid core-shell pastes, such as Cu-core/Ag-shell (Ag/Cu) configurations, mitigate oxidation of Cu and diffusion risks at low temperatures but face limitations in high-temperature processes. To address this, pure Cu and Ni contacts demonstrate a breakthrough, achieving power conversion efficiencies comparable to traditional Ag contacts while slashing Ag usage to almost zero. Meanwhile, Al/Si pastes, while limited by lower voltage, show promise for rear-side metallization if used with Al/(boron doped) Si or Al/Ge alloy mixtures. These comparative findings highlight the trade-offs among Ag-reduction approaches and delineate a clear path toward significantly lower-Ag, high-efficiency silicon solar cells.