Behaviour of PLA/POSS nanocomposites: Effects of filler content, functional group and copolymer compatibilization


POLYMERS & POLYMER COMPOSITES, vol.29, no.9_SUPPL, 2021 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 29 Issue: 9_SUPPL
  • Publication Date: 2021
  • Doi Number: 10.1177/09673911211008020
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, Aerospace Database, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Keywords: Polylactide, polyhedral oligomeric silsesquioxane, maleic anhydride, mechanical properties, thermal properties, POLYHEDRAL OLIGOMERIC SILSESQUIOXANES, MECHANICAL-PROPERTIES, ENHANCED CRYSTALLIZATION, MALEIC-ANHYDRIDE, POSS, TOUGHNESS, COMPOSITES, RESISTANCE, MORPHOLOGY, NANOTUBES
  • Middle East Technical University Affiliated: Yes


The main purpose of this study was to investigate influences of three parameters on the mechanical and thermal properties of the polylactide (PLA) matrix nanocomposites filled with polyhedral oligomeric silsesquioxane (POSS) particles. For the first parameter of "Filler Content", nanocomposites with 1, 3, 5, 7 wt% basic POSS structure were compared. For the second parameter of "Functional Group," basic POSS structure having only nonpolar isobutyl groups were compared with three other functionalized POSS structures; i.e. aminopropylisobutyl-POSS (ap-POSS), propanediolisobutyl-POSS (pd-POSS) and octasilane-POSS (os-POSS). Finally, for the third parameter of "Copolymer Compatibilization," all specimens were compared before and after their maleic anhydride (MA) grafted copolymer compatibilization. Specimens were produced with twin-screw extruder melt mixing and shaped under compression molding. Various tests and analyses indicated that the optimum filler content for the improved mechanical properties was I wt%; while the optimum structure for strength and modulus was pd-POSS structure, in terms of fracture toughness it was basic POSS structure. Additional use of MA compatibilization was especially effective for the basic POSS and os-POSS particles.