Pressure-sensitive adhesive thin films with tailored properties via solvent-free plasma deposition of EHA/AA copolymers

Coplan M., Gursoy M., Mercan E. S., Karaman M.

APPLIED SURFACE SCIENCE, cilt.714, 2025 (SCI-Expanded, Scopus) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 714
  • Basım Tarihi: 2025
  • Doi Numarası: 10.1016/j.apsusc.2025.164514
  • Dergi Adı: APPLIED SURFACE SCIENCE
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Orta Doğu Teknik Üniversitesi Adresli: Hayır

Özet

This study employs plasma-enhanced chemical vapor deposition (PECVD) to address the limitations of conventional techniques in fabricating pressure-sensitive adhesive (PSA) thin films and to introduce advanced functionalities. PECVD provides a solvent-free, environmentally sustainable approach, allowing precise control over film composition and properties. PSA thin films were synthesized using varying feed ratios of 2-ethylhexyl acrylate (EHA) and acrylic acid (AA) monomers. The optimized PSA film was synthesized at a substrate temperature of 5 degrees C, reactor pressure of 150 mTorr, plasma power of 50 W, and an AA/EHA monomer flow rate ratio of 1.5. The chemical, physical, and mechanical characteristics of the films were systematically evaluated. The optimized film demonstrated a shear strength of 158 N/cm2 and a peel strength of 0.87 N/25 mm. Furthermore, the film exhibited excellent solvent resistance and high durability.