Reliability concerns of lead-free solder use in aerospace applications


Baylakoglu I.

3rd International Conference on Recent Advances in Space Technologies, İstanbul, Turkey, 14 - 16 June 2007, pp.158-164 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • Doi Number: 10.1109/rast.2007.4283969
  • City: İstanbul
  • Country: Turkey
  • Page Numbers: pp.158-164

Abstract

In this paper, it has been provided the impact of lead free solder use in electronics to the aerospace electronics in the aerospace environment. These impacts especially have been faced in the areas of reliability, assembly methods, cost drivers, supply chain management, and alternative materials selection. Reliability will probably be the most significant factor for the aerospace industry if it converts to Pb free. So, the question has been addressed by focusing in the reliability issues in this paper. Some information has been summarized from other studies to give an idea and references.