Hybrid Integration of Broadband Silicon Modulators and InGaAs Photodetectors

Karaca U., GÖVDELİ A., KOCAMAN S.

31st Annual IEEE Photonics Conference (IPC) of the IEEE-Photonics-Society, Preston, Birleşik Krallık, 30 Eylül - 04 Ekim 2018 identifier

  • Yayın Türü: Bildiri / Tam Metin Bildiri
  • Basıldığı Şehir: Preston
  • Basıldığı Ülke: Birleşik Krallık
  • Orta Doğu Teknik Üniversitesi Adresli: Evet

Özet

We present on-chip integration of silicon modulators and InGaAs photodetectors via flip-chip bonding. Modulators fabricated on silicon-on-insulator (SOI) and photodetectors grown on InP wafers were fabricated independently and the hybrid integration was achieved by the deposition of indium (In) bumps on both sides.