DESIGN AND IMPLEMENTATION OF HIGH FILL-FACTOR STRUCTURES FOR LOW-COST CMOS MICROBOLOMETERS


Erturk O., Akin T.

31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS), Belfast, United Kingdom, 21 - 25 January 2018, pp.692-695 identifier

  • Publication Type: Conference Paper / Full Text
  • City: Belfast
  • Country: United Kingdom
  • Page Numbers: pp.692-695

Abstract

This paper reports utilization of high-fill factor absorber structures integrated onto SOI diode type low-cost uncooled microbolometers for broadband absorption performance. Mechanical and optical simulations are performed to assess the enhancement and mechanical stability of the absorber structures. Reported first time in the literature, four types of different absorber structures are employed on the same detector focal plane array (FPA) in order to evaluate the improvement provided by different absorber structures comparatively on the same sensor. This study is conducted on 50 mu m pitched pixels with the FPA format of 160 x 120.