Thermoelectric Cooler Design without Using Cold And Hot Face Temperatures


Dağlı B., Üner N. B.

15th International Conference on Computational Heat & Mass Transfer, Antalya, Türkiye, 19 - 22 Mayıs 2025, (Tam Metin Bildiri)

  • Yayın Türü: Bildiri / Tam Metin Bildiri
  • Basıldığı Şehir: Antalya
  • Basıldığı Ülke: Türkiye
  • Orta Doğu Teknik Üniversitesi Adresli: Evet

Özet

Peltier modules are now easily accessible materials for accomplishing thermoelectric cooling for electronics, condensers and essentially any small surface or volume without using moving parts or a refrigerant. Common bismuth telluride-based modules are well characterized through experiments in which face temperatures were measured. In the case of applications, measurement of face temperatures lead to additional costs and custom manufacturing to place thin temperature sensors with small form factors, especially for the hot side on which heat dissipation must be managed at the same time. Moreover, in some specific applications, such as liquid cooling, temperatures are usually measured away from the cold surface and rather in the liquid bulk. Interestingly, a design strategy for predicting the cooling performance of Peltier modules without continuous measurement of hot and cold face temperature is lacking.[NÜ1] [NÜ2]  Ideal calculations should be essentially based on the cooling performance of the hot side and Peltier circuit characteristics.

    This report presents a modeling framework accompanied by supporting experiments to predict cooling performance based on performance metrics of the module, structural parameters and the efficiency of cooling of the hot face. First, a heatsink and fan combination was characterized through steady-state temperature measurements at constant voltage, where hot side temperature is deduced from cold side measurements. These measurements are shown to enable the determination of UAf, the overall heat transfer coefficient multiplied by the effective cooling area of the heatsink with the selected fan. We show that by changing fan speeds, data can be extended to different heatsinks and fans through a generalization that involves fin geometry and efficiency. This framework is then put to use for designing a sub-zero condenser for vapors. A cubical structure was manufactured with four Peltier modules, leading to an ultimate bath temperature of −10°C  at room temperature. By the use of an unsteady-state model, heat leakage from the ambient was characterized. This information was utilized for estimating the actual heat duty of the cooling bath as a function of temperature and condensation performance was measured by removing water vapor in humid stream. We will present the design methodology, along with details related to temperature control, which allow simplified calculation of realistic cooling capacities in various thermoelectric cooling applications.