Large format voltage tunable dual-band QWIP FPAs

Arslan Y., Eker S. U., Kaldirim M., BEŞİKCİ C.

INFRARED PHYSICS & TECHNOLOGY, vol.52, no.6, pp.399-402, 2009 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 52 Issue: 6
  • Publication Date: 2009
  • Doi Number: 10.1016/j.infrared.2009.06.005
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.399-402
  • Middle East Technical University Affiliated: Yes


Third generation thermal imagers with dual/multi-band operation capability are the prominent focus of the current research in the field of infrared detection. Dual band quantum-well infrared photodetector (QWIP) focal plane arrays (FPAs) based on various detection and fabrication approaches have been reported. One of these approaches is the three-contact design allowing simultaneous integration of the signals in both bands. However, this approach requires three In bumps on each pixel leading to a complicated fabrication process and lower fill factor.