In this article, a study on the formation of intermetallic compounds at the interface between aluminum thin film and silicon substrate is presented. We studied four systems: Al/Si, Al-(5at%)Fe/Si, Al-(5at%)Cr/Si, and Al-(5at%)Ni/Si. After vacuum deposition of the films, the samples were annealed at different temperatures and time intervals. X-ray, SEM, and EDS analysis showed the sequential formation of several intermetallic phases at the interfaces. Using this data, a model will be given about the formation of the observed intermetallic phases.