LOW-TEMPERATURE AU-IN TLP BONDING FOR COMPACT HERMETIC PACKAGING OF PIEZOELECTRIC MEMS DEVICES
23rd International Conference on Solid State Sensors, Actuators and Microsystems-Transducers, Florida, United States Of America, 29 June - 03 July 2025, pp.1461-1464, (Full Text)
- Publication Type: Conference Paper / Full Text
- Doi Number: 10.1109/transducers61432.2025.11110503
- City: Florida
- Country: United States Of America
- Page Numbers: pp.1461-1464
- Middle East Technical University Affiliated: Yes
Abstract
This study introduces a compact, low-temperature Au-In transient liquid phase (TLP) bonding-based packaging method for piezoelectric MEMS transducers with lateral feedthroughs. The packaging process uses silicon caps fabricated in a three-step process, while the Au-In bonding stack is designed to prevent premature intermetallic compound (IMC) formation. The transducers are fabricated on SOI wafers with low-temperature PECVD insulation layers, ensuring compatibility with piezoelectric material. The packaged transducer generates a peak voltage of 163.1 mVpp under 0.1 g excitation at 570.9 Hz. The results demonstrate the effectiveness of the proposed method in achieving compact MEMS packaging while indicating that the sensor remains operational after packaging.