Atıf İçin Kopyala
Foulkes T., Gurumukhi Y., Popovic G., GÜNAY A. A., Bosch S., Liao Z., ...Daha Fazla
International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2019, Anaheim, CA, Amerika Birleşik Devletleri, 7 - 09 Ekim 2019