Spray cooling for electronics cooling applications offers superior performance due to the atomization and two-phase flow abilities. Need for spray cooling in thermal applications is on the rise due to increasing heat fluxes and demanding reliability specifications. Unfortunately, it is a very laborious task to predict Critical Heat Fluxes (CHF) for spray cooling by means of Computational Fluid Dynamics (CFD). Therefore, thermal engineers generally prefer using empirical correlations to determine capabilities of spray cooling for electronics. In this study, one of the empirical correlations was tested by performing several experiments by varying the fluid type, the angle of spray nozzle and the flow rate.