Effects and characterisations of pulse electrodeposition parameters of silver in terms of scattering parameter and surface roughness for waveguides operating at high frequencies

Başaran C., KARAKAYA İ.

International Journal of Surface Science and Engineering, vol.15, no.2, pp.118-130, 2021 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 15 Issue: 2
  • Publication Date: 2021
  • Doi Number: 10.1504/ijsurfse.2021.116326
  • Journal Name: International Journal of Surface Science and Engineering
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, PASCAL, Aerospace Database, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Page Numbers: pp.118-130
  • Keywords: silver plating, pulse electrodeposition, morphology, grain size, scattering parameter, return loss, MORPHOLOGY
  • Middle East Technical University Affiliated: Yes

Abstract

© 2021 Inderscience Enterprises Ltd.The signal quality of antennas and waveguides in the transmission of electromagnetic waves are very much dependent on the surface finish of these devices. Effects of pulse parameters on the surface properties of silver coatings of the copper substrates have been analysed in terms of surface roughness and S-parameter (scattering parameter). The duty cycle, frequency and average current density were used as three pulse parameters. Three levels were selected for each parameter in the experimental design. The surface finish was found to be directly proportional to duty cycle and average current density but inversely proportional to frequency. The S11 scattering parameter observations were made relative to a gold-plated reference coupon. It was analysed that the smoother surface had more reflection power in terms of S11 parameter thus decreasing the loss of radiation.