Investigation of warpage behavior of single crystal silicon on a silicon Adhesive ceramic integrated structure at cryogenic temperatures

BALOĞLU C., OKUTUCU ÖZYURT H. T. , DURSUNKAYA Z.

IMAPS 12th International Conference and Exhibition on Device Packaging, Fountain Hills, United States Of America, 14 - 17 March 2016 identifier identifier

  • Publication Type: Conference Paper / Full Text
  • City: Fountain Hills
  • Country: United States Of America