Investigation of warpage behavior of single crystal silicon on a silicon Adhesive ceramic integrated structure at cryogenic temperatures

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BALOĞLU C., OKUTUCU ÖZYURT H. T., DURSUNKAYA Z.

IMAPS 12th International Conference and Exhibition on Device Packaging, Fountain Hills, United States Of America, 14 - 17 March 2016, (Full Text)

• Publication Type: Conference Paper / Full Text
• City: Fountain Hills
• Country: United States Of America
• Middle East Technical University Affiliated: Yes