Thermal characterization of glycidyl azide polymer (GAP) and GAP-based binders for composite propellants

Selim K., Ozkar S. , Yilmaz L.

JOURNAL OF APPLIED POLYMER SCIENCE, vol.77, no.3, pp.538-546, 2000 (Journal Indexed in SCI) identifier

  • Publication Type: Article / Article
  • Volume: 77 Issue: 3
  • Publication Date: 2000
  • Doi Number: 10.1002/(sici)1097-4628(20000718)77:3<538::aid-app9>;2-x
  • Page Numbers: pp.538-546
  • Keywords: glycidyl azide polymer, energetic binder, composite propellant, thermal characterization, plasticizer, ENERGETIC MATERIALS, HEXANITROHEXAAZAISOWURTZITANE, DECOMPOSITION, COMBUSTION, STABILITY


Differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA) were used to investigate the thermal behavior of glycidyl azide polymer (GAP) and GAP-based binders, which are of potential interest for the development of high-performance energetic propellants. The glass transition temperature (T-g) and decomposition temperature (T-d) of pure GAP were found to be -45 and 242 degrees C, respectively. The energy released during decomposition (Delta H-d) was measured as 485 cal/g. The effect of the heating rate on these properties was also investigated. Then, to decrease its T-g, GAP was mixed with the plasticizers dioctiladipate (DOA) and bis-2,2-dinitropropyl acetal formal (BDNPA/F). The thermal characterization results showed that BDNPA/F is a suitable plasticiser for GAP-based propellants. Later, GAP was crosslinked by using the curing agent triisocyanate N-100 and a curing catalyst dibuthyltin dilaurate (DBTDL). The thermal characterization showed that crosslinking increases the T-g and decreases the T-d of GAP. The T-g of cured GAP was decreased to sufficiently low temperatures (-45 degrees C) by using BDNPA/F. The decomposition reaction-rate constants were calculated. It can be concluded that the binder developed by using GAP/N-100/BDNPA/F/DBTDL may meet the requirements of the properties that makes it useful for future propellant formulations. (C) 2000 John Wiley & Sons, Inc.