Effect of Sn Alloying on the Diffusion Bonding Behavior of Al-Mg-Si Alloys

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Atıf İçin Kopyala

Atabay S. E., Esen Z., DERİCİOĞLU A. F.

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, sa.7, ss.3181-3187, 2017 (SCI-Expanded)

• Yayın Türü: Makale / Tam Makale
• Basım Tarihi: 2017
• Doi Numarası: 10.1007/s11661-017-4089-7
• Dergi Adı: METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
• Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
• Sayfa Sayıları: ss.3181-3187
• Orta Doğu Teknik Üniversitesi Adresli: Evet

Özet

Effect of Sn as an alloying element on the diffusion-bonding behavior of Al-Mg-Si alloy has been studied by means of differential scanning calorimetry (DSC), X-ray diffraction (XRD), scanning electron microscopy (SEM) and mechanical testing of the diffusion-bonded joint. XRD results revealed the formation of Mg2Sn and (Sn) phases during solidification following induction casting. DSC results showed local liquid (Sn) formation during the bonding process for Sn-containing alloys, where its amount was found to be increasing with the increasing Sn content. Results revealed that Sn addition leads to an increase in the bond shear strength of the diffusion-bonded joints and elimination of the irregularities formed on the bonded interface. Fractured surfaces showed that formation of (Sn) layer at the bonded interface causes the fracture to transform from the ductile to the mixed fracture mode.