Effect of Sn Alloying on the Diffusion Bonding Behavior of Al-Mg-Si Alloys


Atabay S. E. , Esen Z., DERİCİOĞLU A. F.

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, ss.3181-3187, 2017 (SCI İndekslerine Giren Dergi) identifier identifier

  • Basım Tarihi: 2017
  • Doi Numarası: 10.1007/s11661-017-4089-7
  • Dergi Adı: METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
  • Sayfa Sayıları: ss.3181-3187

Özet

Effect of Sn as an alloying element on the diffusion-bonding behavior of Al-Mg-Si alloy has been studied by means of differential scanning calorimetry (DSC), X-ray diffraction (XRD), scanning electron microscopy (SEM) and mechanical testing of the diffusion-bonded joint. XRD results revealed the formation of Mg2Sn and (Sn) phases during solidification following induction casting. DSC results showed local liquid (Sn) formation during the bonding process for Sn-containing alloys, where its amount was found to be increasing with the increasing Sn content. Results revealed that Sn addition leads to an increase in the bond shear strength of the diffusion-bonded joints and elimination of the irregularities formed on the bonded interface. Fractured surfaces showed that formation of (Sn) layer at the bonded interface causes the fracture to transform from the ductile to the mixed fracture mode.