A Novel Method for Fabricating MEMS Three-Axis Accelerometers using Low Temperature Au-Sn Eutectic Bonding

Tez S., Torunbalci M. M., Akın T.

15th IEEE Sensors Conference, Florida, Amerika Birleşik Devletleri, 30 Ekim - 03 Kasım 2016 identifier

  • Yayın Türü: Bildiri / Tam Metin Bildiri
  • Basıldığı Şehir: Florida
  • Basıldığı Ülke: Amerika Birleşik Devletleri
  • Anahtar Kelimeler: MEMS three-axis accelerometer, glass-silicon-glass multi-stack, Gold-Tin eutectic bonding
  • Orta Doğu Teknik Üniversitesi Adresli: Evet

Özet

This paper presents a novel method for the fabrication of three-axis capacitive MEMS accelerometers by using low-temperature Au-Sn eutectic bonding that is applied to form a glass-silicon-glass multi-stack. The proposed method provides the implementation of individual in-plane and out-of-plane accelerometer elements in the same die using a glass-silicon-glass multi-stack structure formed at temperatures as low as 300 degrees C while still ensuring the advantages of the previous approaches such as the voltage free bonding, inherent capping, and the differential sensing. The initial prototypes are verified to be functional and mechanically strong (>9.5MPa) by C-V measurements and shear strength tests.