Hybrid Integration of Broadband Silicon Modulators and InGaAs Photodetectors
31st Annual IEEE Photonics Conference (IPC) of the IEEE-Photonics-Society, Preston, Birleşik Krallık, 30 Eylül - 04 Ekim 2018, (Tam Metin Bildiri)
- Yayın Türü: Bildiri / Tam Metin Bildiri
- Basıldığı Şehir: Preston
- Basıldığı Ülke: Birleşik Krallık
- Orta Doğu Teknik Üniversitesi Adresli: Evet
Özet
We present on-chip integration of silicon modulators and InGaAs photodetectors via flip-chip bonding. Modulators fabricated on silicon-on-insulator (SOI) and photodetectors grown on InP wafers were fabricated independently and the hybrid integration was achieved by the deposition of indium (In) bumps on both sides.