Hybrid Integration of Broadband Silicon Modulators and InGaAs Photodetectors

Karaca U., GÖVDELİ A., KOCAMAN S.

31st Annual IEEE Photonics Conference (IPC) of the IEEE-Photonics-Society, Preston, United Kingdom, 30 September - 04 October 2018 identifier

  • Publication Type: Conference Paper / Full Text
  • City: Preston
  • Country: United Kingdom
  • Middle East Technical University Affiliated: Yes

Abstract

We present on-chip integration of silicon modulators and InGaAs photodetectors via flip-chip bonding. Modulators fabricated on silicon-on-insulator (SOI) and photodetectors grown on InP wafers were fabricated independently and the hybrid integration was achieved by the deposition of indium (In) bumps on both sides.