Low-Temperature Au-In TLP Bonding for Compact Hermetic Packaging of Piezoelectric MEMS Devices

Balcı L. D., Atik A. C., Yüksel M. B., Külah H.

Transducers 2025, Florida, United States Of America, 29 June - 03 July 2025, pp.1, (Full Text)

• Publication Type: Conference Paper / Full Text
• Doi Number: 10.1109/transducers61432.2025.11110503
• City: Florida
• Country: United States Of America
• Page Numbers: pp.1
• Middle East Technical University Affiliated: Yes