LOW-TEMPERATURE AU-IN TLP BONDING FOR COMPACT HERMETIC PACKAGING OF PIEZOELECTRIC MEMS DEVICES
23rd International Conference on Solid State Sensors, Actuators and Microsystems-Transducers, Florida, Amerika Birleşik Devletleri, 29 Haziran - 03 Temmuz 2025, ss.1461-1464, (Tam Metin Bildiri)
- Yayın Türü: Bildiri / Tam Metin Bildiri
- Doi Numarası: 10.1109/transducers61432.2025.11110503
- Basıldığı Şehir: Florida
- Basıldığı Ülke: Amerika Birleşik Devletleri
- Sayfa Sayıları: ss.1461-1464
- Orta Doğu Teknik Üniversitesi Adresli: Evet
Özet
This study introduces a compact, low-temperature Au-In transient liquid phase (TLP) bonding-based packaging method for piezoelectric MEMS transducers with lateral feedthroughs. The packaging process uses silicon caps fabricated in a three-step process, while the Au-In bonding stack is designed to prevent premature intermetallic compound (IMC) formation. The transducers are fabricated on SOI wafers with low-temperature PECVD insulation layers, ensuring compatibility with piezoelectric material. The packaged transducer generates a peak voltage of 163.1 mVpp under 0.1 g excitation at 570.9 Hz. The results demonstrate the effectiveness of the proposed method in achieving compact MEMS packaging while indicating that the sensor remains operational after packaging.