Thesis Type: Postgraduate
Institution Of The Thesis: Orta Doğu Teknik Üniversitesi, Faculty of Engineering, Department of Mechanical Engineering, Turkey
Approval Date: 2008
Student: BANU AYTEKİN
Supervisor: HASAN NEVZAT ÖZGÜVENAbstract:
In this thesis, vibration analyses of electronic assemblies that consist of an electronic box, printed circuit board and electronic components are presented. A detailed vibration analysis of a real electronic assembly is performed by finite element methods and vibration tests. Effects of component addition and component modeling are investigated by finite element analysis in detail. Results are compared in order to identify the most efficient, reliable and suitable method depending on the type of problem. Experimental results for the vibration of an electronic box, PCB and components are presented and discussed. Furthermore, an analytical model that represents a printed circuit board and electronic component is suggested for fixed and simply supported boundary conditions of the PCB. Different types of electronic components are modeled analytically to observe different dynamic characteristics. The validity of the analytical model is computationally checked by comparing results with those of finite element solution.