Torunbalci, M. M. Et Al. 2014. Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs. 13th IEEE SENSORS Conference, SENSORS 2014 , (Valencia, Spain), 2187-2190.

Torunbalci, M. M., Demir, E. C., Donmez, I., Alper, S. E., & Akın, T., (2014). Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs . 13th IEEE SENSORS Conference, SENSORS 2014 (pp.2187-2190). Valencia, Spain

Torunbalci, Mustafa Et Al. "Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs," 13th IEEE SENSORS Conference, SENSORS 2014, Valencia, Spain, 2014

Torunbalci, Mustafa M. Et Al. "Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs." 13th IEEE SENSORS Conference, SENSORS 2014 , Valencia, Spain, pp.2187-2190, 2014

Torunbalci, M. M. Et Al. (2014) . "Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs." 13th IEEE SENSORS Conference, SENSORS 2014 , Valencia, Spain, pp.2187-2190.

@conferencepaper{conferencepaper, author={Mustafa Mert Torunbalci Et Al. }, title={Gold-tin eutectic bonding for hermetic packaging of MEMS devices with vertical feedthroughs}, congress name={13th IEEE SENSORS Conference, SENSORS 2014}, city={Valencia}, country={Spain}, year={2014}, pages={2187-2190} }