Yetgin, H. Et Al. 2020. Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles. International Journal of Adhesion and Adhesives , vol.98 .

Yetgin, H., Veziroglu, S., Aktas, O. C., & Yalçınkaya, T., (2020). Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles. International Journal of Adhesion and Adhesives , vol.98.

Yetgin, Hasan Et Al. "Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles," International Journal of Adhesion and Adhesives , vol.98, 2020

Yetgin, Hasan Et Al. "Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles." International Journal of Adhesion and Adhesives , vol.98, 2020

Yetgin, H. Et Al. (2020) . "Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles." International Journal of Adhesion and Adhesives , vol.98.

@article{article, author={Hasan Yetgin Et Al. }, title={Enhancing thermal conductivity of epoxy with a binary filler system of h-BN platelets and Al2O3 nanoparticles}, journal={International Journal of Adhesion and Adhesives}, year=2020}